 TGFR: Track Gap Filled Resin |
| What is ; |
TGFR is the technique and process for filling the conductor spaces, which copper thickness is over 5oz, with special resin. |
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 Effect |
 Excellent withstanding voltage and insulation between tracks
Effect on keeping thermal balance on PCB surface while it’s operating
Increase thermal effects for bare boards & surface mounted components
Secure reliability in insulation at operating condition like high temperature and humidity
Prevent soldering short & contamination while assembling
Reduce bow & twist of PCB and defect rate in assembling process by filling conductor space
Diminish heavy copper PCB weight & size by thinner insulation layer.
Diminish PCB layer
Reduce thickness of dielectric layers for multi-copper thickness PCB
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| Application |
HICH CURRENT PRODUCT
AUTO MOBILE
DC/DC CONVERTER
JUNCTION BOX |
