| A |
Line Width(Inner Layer) |
Min.Copper thickness. + 100㎛ |
| Line Width(Outer Layer) |
Min.Copper thickness' + 100㎛ |
|
|
| B |
Line space(Inner Layer) |
Min.Copper thickness. + 50㎛ |
| Line space(Outer Layer) |
Min.Copper thickness. + 50㎛ |
|
|
| c |
Out Layer Copper Thickness |
Max.4 oz |
| Inner Layer Copper Thickness |
Max.12 oz |
|
|
| D |
Thickness of Dielectric Layer |
More than 50㎛ |
|
|
|
|
| F |
Via Hole Land(Outer / Inner) |
Min.0.60mm / 0.80mm |
|
|
| G |
Buried Via Hole |
Min.0.20Φ |
|
|
| H |
Buried Via Hole Land |
Min.0.65mm |
|
|
| |
Under Etching |
Less than 50% of copper Thickness. |
|
